Bridging Silicon Valley and Taiwan: Semiconductor & AI Synergies
A historic first: Taiwan brings its innovation engine to Silicon Valley to engage America’s next breakthrough startups. Where semiconductor power meets AI ambition, a new U.S.–Taiwan innovation bridge begins.
This landmark event marks the debut of Taiwan’s leading innovation institutions—TCA, InnoVEX, and the ICTGC program—on U.S. soil, signaling a bold national effort to support and attract American early-stage founders. For decades, Taiwan has powered the world’s most advanced chips, manufacturing capabilities, and hardware ecosystems. Now, for the first time, it is bringing those strengths directly to the heart of Silicon Valley, creating an unprecedented opportunity for founders working in AI, robotics, next-generation computing, and deep-tech fields.
By connecting Silicon Valley’s speed of innovation with Taiwan’s unmatched ability to build and scale complex technologies, the event establishes a new model for cross-border collaboration. Startups attending will gain insights into Taiwan’s grant programs, prototyping support, and pathways to scale, while engaging directly with leaders from TCA, InnoVEX, and Taiwan’s National Science and Technology Council. Together, this collaboration lays the foundation for the next wave of technological breakthroughs—one where U.S. creativity and Taiwan’s engineering excellence combine to shape the future of global innovation.
Event Links
Tickets: https://go.evvnt.com/3384600-0
